| Type | Term | Title | Author | Replies |
Last Post |
|---|---|---|---|---|---|
| Published Research | modulus | Carrier Films Behavior During Thermoforming Process Studied Using Dynamic Mechanical Thermal Analysis (DMTA) | Shehdeh Jodeh | 2012-12-14 14:07 | |
| Published Research | modulus | A New Composition–Processing–Property Relationship for Studying the Tensile Modulus-Phase Plastic Blends | Shehdeh Jodeh | 2012-12-14 10:57 |
The responsibility of all materials published at this website belongs to its authors.
