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Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th

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Wed, 2014-06-04 09:07 — Falah Mohammed
Research Title: 
Development of novel carbon nanotube TSV technology
Authors: 
Gupta, Anurag
Authors: 
Kannan, Sukeshwar
Authors: 
Kim, B.C.
Authors: 
Mohammed, F.
Authors: 
Byoungchul Ahn
Country: 
USA
Date: 
Tue, 2010-06-01
Research Abstract: 

The design and development of reliable 3D integrated systems require high performance interconnects, which in turn are largely dependent on the choice of filler material used in TSV. Cu, W, and poly-silicon have been explored as filler materials; however, issues like thermal incompatibility, electromigration and high resistivity are still a bottleneck. In this paper, we investigate SW-CNT bundles as a prospective filler material for TSV.